JPS6166952U - - Google Patents
Info
- Publication number
- JPS6166952U JPS6166952U JP15137884U JP15137884U JPS6166952U JP S6166952 U JPS6166952 U JP S6166952U JP 15137884 U JP15137884 U JP 15137884U JP 15137884 U JP15137884 U JP 15137884U JP S6166952 U JPS6166952 U JP S6166952U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- package
- ring
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 4
- 239000011324 bead Substances 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15137884U JPS6166952U (en]) | 1984-10-05 | 1984-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15137884U JPS6166952U (en]) | 1984-10-05 | 1984-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6166952U true JPS6166952U (en]) | 1986-05-08 |
Family
ID=30709492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15137884U Pending JPS6166952U (en]) | 1984-10-05 | 1984-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6166952U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100966337B1 (ko) | 2008-05-16 | 2010-06-28 | 삼성전기주식회사 | 패키지 기판용 리드핀을 패키지 기판에 접합하는 방법 |
-
1984
- 1984-10-05 JP JP15137884U patent/JPS6166952U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100966337B1 (ko) | 2008-05-16 | 2010-06-28 | 삼성전기주식회사 | 패키지 기판용 리드핀을 패키지 기판에 접합하는 방법 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6166952U (en]) | ||
| JPH0444424B2 (en]) | ||
| JPS60194347U (ja) | リ−ドピン | |
| JPS58369U (ja) | 配線間接続用金具 | |
| JPS6419640A (en) | Manufacture of rivet type contact | |
| JPH01121941U (en]) | ||
| JPH0265494U (en]) | ||
| JPH0621298A (ja) | 成形金型 | |
| JPS6066031U (ja) | 半導体装置 | |
| JPS6278860A (ja) | 樹脂封止型半導体装置 | |
| JPH0150520B2 (en]) | ||
| JPH03128939U (en]) | ||
| JPH0167743U (en]) | ||
| JPH0645390A (ja) | ボール式ワイヤーボンディング方法 | |
| JPS61171248U (en]) | ||
| JPS5829871U (ja) | ワイヤ溶接構造 | |
| JPS6361135U (en]) | ||
| JPH04118822A (ja) | リベット型両頭接点の製造方法 | |
| JPH0334239U (en]) | ||
| JPH0348241U (en]) | ||
| JPS61136552U (en]) | ||
| JPS61177458U (en]) | ||
| JPS6221546U (en]) | ||
| JPS62138460U (en]) | ||
| JPS58120665U (ja) | リ−ドフレ−ム |